Amat P5000 Cvd Manual
RIT Title: Applied Materials P5000 Semiconductor & Microsystems Fabrication Laboratory Revision: G Rev Date: Approved by: Process Engineer / / / / Equipment Engineer 1 SCOPE The purpose of this document is to detail the use of the Applied Materials P5000. All users are expected to have read and understood this document. It is not a substitute for in-person training on the system and is not sufficient to qualify a user on the system. Failure to follow guidelines in this document may result in loss of privileges.
Cat P5000 Manual
2 REFERENCE DOCUMENTS o Material Safety Data Sheets o Appropriate Tool Manuals 3 DEFINITIONS n/a 4 TOOLS AND MATERIALS 4.1 General Description 4.1.1 The P5000 is a load locked system with 4 process chambers. Chamber A is for TEOS depositions, Chamber B is for Plasma Nitride depositions, Chamber C is for Oxide and Nitride etching and Chamber D is not active. 4.2 Wafer Cassettes 4.2.1 There are dedicated 6” wafer cassettes for the P5000 which are labeled. 5 SAFETY PRECAUTIONS 5.1 Hazards to the Operator 5.1.1 The system uses a number of different gases including silane and ammonia which are hazardous. Read and understand the material safety data sheets (MSDS) for all RIT SMFL Page 1 of 11.
Amat P5000 Cvd Manual 2016
Aixtron LYNX3, TM CVD-WSIXAixtron LYNX3, TM CVD-WSIXAixtron LYNX3 WSI CVDAIXTRON INC LYNX3, TM CVD-WSIXAIXTRON INC LYNX3, TM CVD-WSIXAIXTRON INC. LYNX3 WSI CVDAlcantech/ Quester APT-4800 CVDAMAT Centura 4.0 Polycide HT PolycideAMAT Centura 4.0 Polycide HT PolycideAMAT P-5000 CVDAMAT P-5000 CVDAMAT P 5000 1 ch. MXP+ / 1 MkIIAMAT P 5000 1 ch.
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